Invention Grant
- Patent Title: Method for fabrication conductive winding structure
- Patent Title (中): 导电绕组结构的制造方法
-
Application No.: US12326242Application Date: 2008-12-02
-
Publication No.: US08191239B2Publication Date: 2012-06-05
- Inventor: Ming-Tsung Lee , Yung-Yu Chang , Chen-Yu Yu , Jui-Yuan Hsu , Chen-Tsai Hsieh
- Applicant: Ming-Tsung Lee , Yung-Yu Chang , Chen-Yu Yu , Jui-Yuan Hsu , Chen-Tsai Hsieh
- Applicant Address: TW Taoyuan Hsien
- Assignee: Delta Electronics, Inc.
- Current Assignee: Delta Electronics, Inc.
- Current Assignee Address: TW Taoyuan Hsien
- Agency: Kirton McConkie
- Agent Evan R. Witt
- Priority: TW97120488A 20080602
- Main IPC: H01F7/06
- IPC: H01F7/06

Abstract:
A conductive winding structure, the fabricating method thereof, and the magnetic device having the same. The method for fabricating the conductive winding structure includes: (a) providing a mold with a plurality of extension portions and a plurality of protrusions, the plurality of extension portions are connected to each other as a continuous spiral structure, and the plurality of protrusions extend from the plurality of extension portions; (b) performing an electroforming procedure to form a conductive layer on partial surface of the mold; and (c) stripping the conductive layer from the mold, so as to obtain the conductive winding structure.
Public/Granted literature
- US20090293260A1 CONDUCTIVE WINDING STRUCTURE, THE FABRICATING METHOD THEREOF, AND THE MAGNETIC DEVICE HAVING THE SAME Public/Granted day:2009-12-03
Information query