Invention Grant
- Patent Title: Method for making an embedded structure
- Patent Title (中): 制作嵌入式结构的方法
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Application No.: US12211816Application Date: 2008-09-17
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Publication No.: US08191248B2Publication Date: 2012-06-05
- Inventor: Yi-Chun Liu , Wei-Ming Cheng , Tsung-Yuan Chen , Shu-Sheng Chiang
- Applicant: Yi-Chun Liu , Wei-Ming Cheng , Tsung-Yuan Chen , Shu-Sheng Chiang
- Applicant Address: TW Kwei-San Industrial Zone, Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Kwei-San Industrial Zone, Taoyuan
- Agent Winston Hsu; Scott Margo
- Main IPC: H01K3/10
- IPC: H01K3/10
Abstract:
An embedded structure of circuit board is provided. The embedded structure of the present invention includes a dielectric layer, a pad opening disposed in the dielectric layer, and a via disposed in the pad opening and in the dielectric layer, wherein the outer surface of the dielectric layer has a substantially even surface.
Public/Granted literature
- US20100065324A1 EMBEDDED STRUCTURE AND METHOD FOR MAKING THE SAME Public/Granted day:2010-03-18
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