Invention Grant
- Patent Title: Method for processing terminal treatment of braid of a shield wire
- Patent Title (中): 屏蔽线编织端子处理方法
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Application No.: US12457021Application Date: 2009-05-29
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Publication No.: US08191250B2Publication Date: 2012-06-05
- Inventor: Nobuhiro Kawase , Hirofumi Hirayama
- Applicant: Nobuhiro Kawase , Hirofumi Hirayama
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Edwards Wildman Palmer LLP
- Priority: JP2008-174599 20080703
- Main IPC: H01R43/00
- IPC: H01R43/00

Abstract:
For providing a shield wire, in which efficiency of processing terminal treatment of braid can be improved, and an apparatus for processing terminal treatment of braid, an apparatus for processing terminal treatment of braid of a shield wire includes a first hold unit holding a top of the braid covering the electric wire, a second hold unit holding a far-side of the braid, a push unit pushing the top toward the far-side so as to fold a part of braid from the top to form an overlap portion, and a forming unit forming the overlap portion into a cone shape, in which the top is located. The formed overlap portion is clamped by a set of inner and outer ring brackets.
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