Invention Grant
- Patent Title: Pressure sensitive sensor and manufacturing method thereof
- Patent Title (中): 压敏传感器及其制造方法
-
Application No.: US12974011Application Date: 2010-12-21
-
Publication No.: US08191427B2Publication Date: 2012-06-05
- Inventor: Masato Hattori , Masaaki Shimizu
- Applicant: Masato Hattori , Masaaki Shimizu
- Applicant Address: JP Shizuoka-pref.
- Assignee: ASMO Co., Ltd.
- Current Assignee: ASMO Co., Ltd.
- Current Assignee Address: JP Shizuoka-pref.
- Agency: Posz Law Group, PLC
- Priority: JP2010-019519 20100129
- Main IPC: G01L9/00
- IPC: G01L9/00 ; G08B21/00 ; G01R27/26
Abstract:
A molten dielectric resin material is filled in a section of an inside of a hollow dielectric body, in which electrode wires are installed. The molten dielectric resin material is solidified to form filler resin, so that the hollow dielectric body has a sensor portion, in which the filler resin is not filled in the inside of the hollow dielectric body, and a non-sensor portion, in which the filler resin is filled in the inside of the hollow dielectric body. A power supply connector is installed to one end part of the hollow dielectric body located at the non-sensor portion side and includes a plurality of electrically conductive terminals that are electrically connected to the plurality of electrode wires.
Public/Granted literature
- US20110185819A1 PRESSURE SENSITIVE SENSOR AND MANUFACTURING METHOD THEREOF Public/Granted day:2011-08-04
Information query
