Invention Grant
- Patent Title: Snap action valve with bumper pad
- Patent Title (中): 带缓冲垫的快动阀
-
Application No.: US12424915Application Date: 2009-04-16
-
Publication No.: US08191572B2Publication Date: 2012-06-05
- Inventor: Jason Lefler , William E. Hill , Jordan Sahs
- Applicant: Jason Lefler , William E. Hill , Jordan Sahs
- Applicant Address: US IL Lake Forest
- Assignee: Tenneco Automotive Operating Company Inc.
- Current Assignee: Tenneco Automotive Operating Company Inc.
- Current Assignee Address: US IL Lake Forest
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: F16K15/03
- IPC: F16K15/03

Abstract:
A rotary valve plate adapted for housing within a conduit employs a vibration absorbing bumper pad coupled to the valve plate at a surface thereof adapted to contact an inner surface of the conduit whenever the valve plate is rotated to a closed position. The bumper pad minimizes vibratory noise and improves the durability of the valve plate over extended periods of operation.
Public/Granted literature
- US20100263743A1 SNAP ACTION VALVE WITH BUMPER PAD Public/Granted day:2010-10-21
Information query