Invention Grant
- Patent Title: Cooler module without base panel
- Patent Title (中): 没有底板的冷却器模块
-
Application No.: US12047324Application Date: 2008-03-13
-
Publication No.: US08191612B2Publication Date: 2012-06-05
- Inventor: Tsung-Hsien Huang
- Applicant: Tsung-Hsien Huang
- Agency: Pai Patent & Trademark
- Agent Chao-Chang David Pal
- Priority: TW97101122A 20080111
- Main IPC: F28D15/00
- IPC: F28D15/00 ; H05K7/20

Abstract:
A light, compact, non-bottom panel type cooler module includes a plurality of radiation fins arranged in a stack, and a plurality of U-shaped heat pipes fastened to the radiation fins to hold the radiation fins in parallel, each U-shaped heat pipe having one or two opposite end pipe sections thereof press-fitted into respective through holes on the radiation fins and a flat bottom surface portion exposed to the outside of the radiation fins for bonding to a semiconductor device for enabling the heat pipes to transport heat from the semiconductor device to the radiation fins for dissipation.
Public/Granted literature
- US20090178787A1 COOLER MODULE WITHOUT BASE PANEL Public/Granted day:2009-07-16
Information query