Invention Grant
- Patent Title: Wireless IC device and electronic apparatus
- Patent Title (中): 无线IC器件和电子设备
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Application No.: US13022695Application Date: 2011-02-08
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Publication No.: US08191791B2Publication Date: 2012-06-05
- Inventor: Nobuo Ikemoto , Satoshi Ishino , Yuya Dokai , Noboru Kato , Takeshi Kataya , Ikuhei Kimura , Mikiko Tanaka
- Applicant: Nobuo Ikemoto , Satoshi Ishino , Yuya Dokai , Noboru Kato , Takeshi Kataya , Ikuhei Kimura , Mikiko Tanaka
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2007-185439 20070717; JP2007-271861 20071018; JP2008-092848 20080331
- Main IPC: G06K19/06
- IPC: G06K19/06

Abstract:
A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.
Public/Granted literature
- US20110127337A1 WIRELESS IC DEVICE AND ELECTRONIC APPARATUS Public/Granted day:2011-06-02
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