Invention Grant
- Patent Title: Device, arrangement and method for manufacturing a component
- Patent Title (中): 用于制造部件的装置,布置和方法
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Application No.: US11360888Application Date: 2006-02-23
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Publication No.: US08191854B2Publication Date: 2012-06-05
- Inventor: Vidina Otten , Dirk Siebrecht
- Applicant: Vidina Otten , Dirk Siebrecht
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Priority: DE102005008479 20050224
- Main IPC: B28B7/34
- IPC: B28B7/34

Abstract:
A device for manufacturing a component comprises a trough, into which starting material for manufacturing the component can be introduced, a cover that can be attached to the trough in such a way that starting material for manufacturing the component is enclosed between the trough and the cover, a heating device for manufacturing the component by heating starting material that can be enclosed between the trough and the cover, wherein the trough is manufactured from a material with a coefficient of expansion that is essentially identical to the coefficient of expansion of the starting material for manufacturing the component.
Public/Granted literature
- US20060186580A1 Device, arrangement and method for manufacturing a component Public/Granted day:2006-08-24
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