Invention Grant
US08191988B2 Liquid ejection head, liquid-ejection head substrate, liquid ejecting apparatus including liquid ejection head, and method of cleaning liquid ejection head
有权
液体喷射头,液体喷射头基板,包括液体喷射头的液体喷射装置和清洗液体喷射头的方法
- Patent Title: Liquid ejection head, liquid-ejection head substrate, liquid ejecting apparatus including liquid ejection head, and method of cleaning liquid ejection head
- Patent Title (中): 液体喷射头,液体喷射头基板,包括液体喷射头的液体喷射装置和清洗液体喷射头的方法
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Application No.: US12619556Application Date: 2009-11-16
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Publication No.: US08191988B2Publication Date: 2012-06-05
- Inventor: Takahiro Matsui , Yuzuru Ishida
- Applicant: Takahiro Matsui , Yuzuru Ishida
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA Inc IP Division
- Priority: JP2008-293526 20081117
- Main IPC: B41J2/165
- IPC: B41J2/165 ; B41J2/05

Abstract:
A liquid ejection head includes a liquid-ejection head substrate including an element, which generates thermal energy used for ejecting a liquid from an ejection port, and a protective layer, which covers at least the element, and in which first layers and second layers are alternately stacked; a flow passage member which defines a wall of a flow passage communicating with the ejection port; and a flow-passage electrode disposed in the flow passage.
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