Invention Grant
- Patent Title: Light-emitting module
- Patent Title (中): 发光模块
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Application No.: US12703279Application Date: 2010-02-10
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Publication No.: US08192068B2Publication Date: 2012-06-05
- Inventor: You-Jin Kwon , Won-Il Kim , Hyun-Gu Kang , Seung-Ryeol Ryu , Sang-Geun Bae , Seung-Sik Hong
- Applicant: You-Jin Kwon , Won-Il Kim , Hyun-Gu Kang , Seung-Ryeol Ryu , Sang-Geun Bae , Seung-Sik Hong
- Applicant Address: KR Seoul
- Assignee: Seoul Semiconductor Co., Ltd.
- Current Assignee: Seoul Semiconductor Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: H.C. Park & Associates, PLC
- Main IPC: H01R33/00
- IPC: H01R33/00 ; F21V19/04

Abstract:
A light-emitting module includes a printed circuit board (PCB), a fastening member, and a light-emitting package. The PCB has a power-supplying pad to provide electrical power. The fastening member is disposed on the PCB and has a package-receiving hole exposing the power-supplying pad. The light-emitting package is received by the package-receiving hole such that the light-emitting package is electrically connected to the power-supplying pad and detachably coupled with the fastening member. Therefore, the light-emitting package may be easily combined with the PCB, and the light-emitting package may be replaced when desired.
Public/Granted literature
- US20100328961A1 LIGHT-EMITTING MODULE Public/Granted day:2010-12-30
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