Invention Grant
US08192076B2 Thermal sensor, non-contact thermometer device, and non-contact temperature measurement method
有权
热传感器,非接触式温度计装置和非接触式温度测量方法
- Patent Title: Thermal sensor, non-contact thermometer device, and non-contact temperature measurement method
- Patent Title (中): 热传感器,非接触式温度计装置和非接触式温度测量方法
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Application No.: US13050235Application Date: 2011-03-17
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Publication No.: US08192076B2Publication Date: 2012-06-05
- Inventor: Shinichiro Nawai , Tadamasa Miura
- Applicant: Shinichiro Nawai , Tadamasa Miura
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-fu
- Agency: Dickstein Shapiro LLP
- Priority: JP2008-265945 20081015; JP2009-179022 20090731
- Main IPC: G01J5/00
- IPC: G01J5/00

Abstract:
A thermal sensor that includes a ceramic body formed of NTC thermister ceramic, heat sensing part electrodes, temperature compensation part electrodes, external electrodes, and a cavity. A heat sensing part, which is the surface layer of the ceramic body, is heated by, for example, radiant heat transfer, reducing the resistance value of a thermister ceramic layer between the heat sensing part electrodes. Since the heat of the heat sensing part of the ceramic body is insulated by the cavity and thus prevented from diffusing, the heat capacity of the heat sensing unit is reduced, obtaining high sensitivity and high responsiveness.
Public/Granted literature
- US20110164655A1 Thermal Sensor, Non-Contact Thermometer Device, and Non-Contact Temperature Measurement Method Public/Granted day:2011-07-07
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