Invention Grant
- Patent Title: Thermal data output circuit and multi chip package using the same
- Patent Title (中): 热数据输出电路和多芯片封装使用相同
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Application No.: US12317218Application Date: 2008-12-18
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Publication No.: US08192082B2Publication Date: 2012-06-05
- Inventor: Ho Uk Song , Shin Ho Chu
- Applicant: Ho Uk Song , Shin Ho Chu
- Applicant Address: KR Icheon-si
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Icheon-si
- Agency: Cooper & Dunham LLP
- Agent John P. White
- Priority: KR10-2008-0000368 20080102
- Main IPC: G01K7/00
- IPC: G01K7/00
Abstract:
A temperature data output circuit is provided which is capable of outputting a temperature signal which is enabled when an internal temperature of at least one of the semiconductor memory chips mounted on a multi chip package exceeds a predetermined temperature.
Public/Granted literature
- US20090168840A1 Thermal data output circuit and multi chip package using the same Public/Granted day:2009-07-02
Information query
