Invention Grant
- Patent Title: Electronic part and lead
- Patent Title (中): 电子零件和铅
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Application No.: US13179817Application Date: 2011-07-11
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Publication No.: US08192208B2Publication Date: 2012-06-05
- Inventor: Hiroaki Tamura , Fumihiko Tokura
- Applicant: Hiroaki Tamura , Fumihiko Tokura
- Applicant Address: JP Kawasaki JP Tokyo
- Assignee: Fujitsu Limited,Fujitsu Component Limited
- Current Assignee: Fujitsu Limited,Fujitsu Component Limited
- Current Assignee Address: JP Kawasaki JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2010-164676 20100722
- Main IPC: H01R12/00
- IPC: H01R12/00
Abstract:
A lead configured to join to a signal line of an electronic part through solder is disposed in an opposing relationship to the signal line and extends for sliding movement. A first opposing face section including a pair of faces having wettability to the solder is formed on surfaces of the signal line and the lead. Further, a second opposing face section including a pair of faces having wettability lower than the wettability of the first opposing face section is formed on the surfaces of the signal line and the lead along an extending direction of the lead.
Public/Granted literature
- US20120021617A1 ELECTRONIC PART AND LEAD Public/Granted day:2012-01-26
Information query
