Invention Grant
- Patent Title: Ground clamp kit
- Patent Title (中): 接地夹具套件
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Application No.: US13081142Application Date: 2011-04-06
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Publication No.: US08192210B2Publication Date: 2012-06-05
- Inventor: Michael J. Gardner , Glenn A. Baker
- Applicant: Michael J. Gardner , Glenn A. Baker
- Applicant Address: US OH Cleveland
- Assignee: Halex Co./a Scott-Fetzer Company
- Current Assignee: Halex Co./a Scott-Fetzer Company
- Current Assignee Address: US OH Cleveland
- Agency: Emerson Thomson Bennett
- Agent Roger D. Emerson, Esq.
- Main IPC: H01R13/648
- IPC: H01R13/648

Abstract:
A ground clamp kit may include a first clamp having a wire reception member suitable to receive and electrically connect to an associated electrical wire to be grounded and a second clamp. Each clamp may be suitable to be clamped to an associated grounding component. The ground clamp kit may also include an electric conductor that electrically connects the first clamp to the second clamp.
Public/Granted literature
- US20110294364A1 GROUND CLAMP KIT Public/Granted day:2011-12-01
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