Invention Grant
US08192217B2 Board to board connector with low profile 失效
板对板连接器低调

  • Patent Title: Board to board connector with low profile
  • Patent Title (中): 板对板连接器低调
  • Application No.: US13069385
    Application Date: 2011-03-23
  • Publication No.: US08192217B2
    Publication Date: 2012-06-05
  • Inventor: Yu Zhu
  • Applicant: Yu Zhu
  • Applicant Address: TW New Taipei
  • Assignee: Hon Hai Precision Ind. Co., Ltd
  • Current Assignee: Hon Hai Precision Ind. Co., Ltd
  • Current Assignee Address: TW New Taipei
  • Agent Wei Te Chung; Andrew C. Cheng; Ming Chieh Chang
  • Priority: CN201010187215 20100531
  • Main IPC: H01R13/28
  • IPC: H01R13/28
Board to board connector with low profile
Abstract:
A battery connector includes an insulative housing and a plurality of terminals retained in the housing. The housing defines a mating surface, a rear surface opposite to the mating surface and a plurality of passageways penetrating through the mating surface and the rear surface along a front-to-back direction. At least one pair of first grooves is formed in opposite inner sidewalls of each passageway and running through the rear surface. A pair of slits communicates and is staggered with the corresponding first grooves along a vertical direction perpendicular to the front-to-back direction. Each terminal includes a retention portion with at least one pair of barbs defined at two sides thereof. The retention portions pass through the first grooves along the front-to-back direction and are pressed along the vertical direction so as to retain the barbs in the corresponding slits.
Public/Granted literature
Information query
Patent Agency Ranking
0/0