Invention Grant
US08192228B2 Electronic assembly including RF feedthrough connector and related methods
有权
电子组装包括射频馈通连接器及相关方法
- Patent Title: Electronic assembly including RF feedthrough connector and related methods
- Patent Title (中): 电子组装包括射频馈通连接器及相关方法
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Application No.: US12391847Application Date: 2009-02-24
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Publication No.: US08192228B2Publication Date: 2012-06-05
- Inventor: Edward Allen Taylor
- Applicant: Edward Allen Taylor
- Applicant Address: US FL West Melbourne US FL Melbourne
- Assignee: SRI Hermatics Inc.,H-Tech, LLC
- Current Assignee: SRI Hermatics Inc.,H-Tech, LLC
- Current Assignee Address: US FL West Melbourne US FL Melbourne
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Main IPC: H01R13/40
- IPC: H01R13/40
Abstract:
An electronic assembly may include a housing having an opening therein and an RF feedthrough connector in the opening of the housing. The RF feedthrough connector may include a tubular body, and a plurality of displaceable protrusions carried by an upper outer surface portion of the tubular body. The plurality of displaceable protrusions may define an enlarged upper portion thereof engaging adjacent upper portions of the housing. The RF feedthrough connector may also include a sealed joint between the housing and the RF feedthrough connector.
Public/Granted literature
- US20090211806A1 ELECTRONIC ASSEMBLY INCLUDING RF FEEDTHROUGH CONNECTOR AND RELATED METHODS Public/Granted day:2009-08-27
Information query
