Invention Grant
US08192606B2 Device and a method for metal plating 有权
装置和金属电镀方法

  • Patent Title: Device and a method for metal plating
  • Patent Title (中): 装置和金属电镀方法
  • Application No.: US12158743
    Application Date: 2006-12-19
  • Publication No.: US08192606B2
    Publication Date: 2012-06-05
  • Inventor: Jan Haglund
  • Applicant: Jan Haglund
  • Applicant Address: CH Zürich
  • Assignee: ABB Technology Ltd.
  • Current Assignee: ABB Technology Ltd.
  • Current Assignee Address: CH Zürich
  • Agency: Venable LLP
  • Agent Eric J. Franklin
  • Priority: SE0502893 20051222
  • International Application: PCT/SE2006/050596 WO 20061219
  • International Announcement: WO2007/073339 WO 20070628
  • Main IPC: C25D5/16
  • IPC: C25D5/16
Device and a method for metal plating
Abstract:
A device and a method for metallic electrolytic coating of an object of electrically conductive material, wherein the object has at least two surface portions that are desired to be coated with layers of different thicknesses. The device includes an anode. The device is designed to receive the object in such a way that the object constitutes a cathode and that, upon receipt of the object, a space is formed for receiving a liquid-absorbing material and an electrolyte for coating the object. The body of the anode includes at least two surface portions) that have different electrical conductivity and that are arranged opposite to the surface portions of the received object.
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