Invention Grant
US08192636B2 Composition and method for improved adhesion of polymeric materials to copper alloy surfaces
有权
用于改善聚合材料与铜合金表面的粘合性的组合物和方法
- Patent Title: Composition and method for improved adhesion of polymeric materials to copper alloy surfaces
- Patent Title (中): 用于改善聚合材料与铜合金表面的粘合性的组合物和方法
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Application No.: US12090990Application Date: 2006-10-23
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Publication No.: US08192636B2Publication Date: 2012-06-05
- Inventor: Dirk Tews , Christian Sparing
- Applicant: Dirk Tews , Christian Sparing
- Applicant Address: DE Berlin
- Assignee: Atotech Deutschland GmbH
- Current Assignee: Atotech Deutschland GmbH
- Current Assignee Address: DE Berlin
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Priority: EP05023278 20051025
- International Application: PCT/EP2006/010201 WO 20061023
- International Announcement: WO2007/048559 WO 20070503
- Main IPC: H01L21/306
- IPC: H01L21/306 ; C09K13/00
Abstract:
The present invention relates to a method for treating copper or copper alloy surfaces for tight bonding to polymeric substrates, for example solder masks found in multilayer printed circuit boards. The substrate generally is a semiconductor-device, a lead frame or a printed circuit board.
Public/Granted literature
- US20100035435A1 Composition and Method for Improved Adhesion of Polymeric Materials to Copper or Copper Alloy Surfaces Public/Granted day:2010-02-11
Information query
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