Invention Grant
- Patent Title: Method and apparatus for imprinting microstructure and stamper therefor
- Patent Title (中): 用于印刷微结构和压模的方法和装置
-
Application No.: US12388573Application Date: 2009-02-19
-
Publication No.: US08192637B2Publication Date: 2012-06-05
- Inventor: Ryuta Washiya , Takashi Ando , Masahiko Ogino , Akihiro Miyauchi
- Applicant: Ryuta Washiya , Takashi Ando , Masahiko Ogino , Akihiro Miyauchi
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2008-089186 20080331
- Main IPC: B44C1/22
- IPC: B44C1/22

Abstract:
A method of imprinting a microstructure comprising: contacting a stamper comprising a pattern layer with the microstructure of the order of from micrometers to nanometers in one face of the pattern layer and a substrate supporting the pattern layer with an imprinting member having a deformable layer to which the microstructure is imprinted, wherein the pattern layer is supported on a round surface having a prescribed radius of curvature of the substrate, the center of the round surface protruding towards the rear face of the pattern layer; causing the deformable layer on the imprinting member; and separating the stamper from the cured deformable layer.
Public/Granted literature
- US20090243126A1 METHOD AND APPARATUS FOR IMPRINTING MICROSTRUCTURE AND STAMPER THEREFOR Public/Granted day:2009-10-01
Information query