Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
- Patent Title (中): 基板加工装置及基板处理方法
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Application No.: US12781867Application Date: 2010-05-18
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Publication No.: US08192796B2Publication Date: 2012-06-05
- Inventor: Hiroshi Shinya , Shouichi Terada , Tsuyoshi Mizuno , Yukihiro Wakamoto
- Applicant: Hiroshi Shinya , Shouichi Terada , Tsuyoshi Mizuno , Yukihiro Wakamoto
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, MAier & Neustadt, L.L.P.
- Priority: JP2005-246453 20050826
- Main IPC: B05D3/12
- IPC: B05D3/12
Abstract:
In the present invention, a holding table incorporating a heater is provided, for example, in a treatment container of a planarization unit. A pressing plate having a lower surface formed flat is disposed above the holding table. The pressing plate is movable in the vertical direction and can lower to the holding table to press a resist film on the substrate from above. The pressing plate intermittently presses the upper surface of the resist film to planarize the upper surface while the heater is heating the substrate on the holding table at a predetermined temperature to dry the resist film. According to the present invention, a coating film applied on the substrate can be sufficiently planarized and dried.
Public/Granted literature
- US20100221436A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2010-09-02
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