Invention Grant
- Patent Title: Structured packing with interleaved heat-transfer surfaces
- Patent Title (中): 具有交错传热表面的结构填料
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Application No.: US11903847Application Date: 2007-09-25
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Publication No.: US08192832B1Publication Date: 2012-06-05
- Inventor: Ko C. Lang
- Applicant: Ko C. Lang
- Agent Melanius D'Souza
- Main IPC: B32B3/28
- IPC: B32B3/28 ; B32B3/30 ; F28F3/00
Abstract:
An extruded, ceramic, structured packing has a plurality of partition-plates attached to end-walls. The partition-plates have a plurality of parallel, interleaved ribs which run from the leading flow-edge to the trailing flow-edge of the partition plate to create a serpentine cross-sectioned flow-channel between an adjacent pair of partition plates and the end-walls.
Information query
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