Invention Grant
- Patent Title: Adhesive layer composition for in-mold decoration
- Patent Title (中): 用于模内装饰的粘合剂层组合物
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Application No.: US12337478Application Date: 2008-12-17
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Publication No.: US08192837B2Publication Date: 2012-06-05
- Inventor: Xiaojia Wang , Cheri Pereria , Pei-Lin Wang , Jing-Den Chen , Rong-Chang Liang
- Applicant: Xiaojia Wang , Cheri Pereria , Pei-Lin Wang , Jing-Den Chen , Rong-Chang Liang
- Applicant Address: TW Taoyuan County
- Assignee: Etansi Inc.
- Current Assignee: Etansi Inc.
- Current Assignee Address: TW Taoyuan County
- Agency: Jianq Chyun IP Office
- Main IPC: A01K1/015
- IPC: A01K1/015 ; B28B7/22 ; B28B7/36 ; B28B7/38 ; B32B5/16 ; B32B7/12 ; B32B15/04 ; B41B11/54 ; B29C33/56 ; B29C41/32 ; B29C45/14 ; B60C1/00 ; C04B28/14 ; C08F8/00 ; C08F8/30 ; C08F283/04 ; C08F290/04 ; C08G18/08 ; C08G63/48 ; C08G63/91 ; C08J3/02 ; C08K3/20 ; C08K3/26 ; C08K3/30 ; C08K3/34 ; C08K3/40 ; C08K9/00 ; C08K9/04 ; C08L51/00 ; C08L75/00 ; C08L83/00 ; C09B67/00 ; C09C1/42 ; C09D5/02 ; C09D17/00 ; C09K19/00
Abstract:
This invention relates to compositions suitable for the formation of an adhesive layer used for in-mold decoration. This invention also relates to in-mold decoration tape or strip, comprising: a carrier layer; a release layer; a durable layer; and an adhesive layer which comprises an adhesive binder, a polymeric particulate material and an inorganic particulate material.
Public/Granted literature
- US20090098362A1 ADHESIVE LAYER COMPOSITION FOR IN-MOLD DECORATION Public/Granted day:2009-04-16
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