Invention Grant
US08192915B2 Positive resist composition, method of forming resist pattern, and polymeric compound
有权
正型抗蚀剂组合物，形成抗蚀剂图案的方法和聚合物
- Patent Title: Positive resist composition, method of forming resist pattern, and polymeric compound
- Patent Title (中): 正型抗蚀剂组合物，形成抗蚀剂图案的方法和聚合物
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Application No.: US12461687Application Date: 2009-08-20
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Publication No.: US08192915B2Publication Date: 2012-06-05
- Inventor: Takahiro Dazai , Tomoyuki Hirano , Daiju Shiono , Tasuku Matsumiya
- Applicant: Takahiro Dazai , Tomoyuki Hirano , Daiju Shiono , Tasuku Matsumiya
- Applicant Address: JP Kanagawa-Ken
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kanagawa-Ken
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPP2008-214688 20080822; JPP2008-285755 20081106; JPP2009-185958 20090810
- Main IPC: G03F7/028
- IPC: G03F7/028 ; G03F7/038 ; G03F7/28 ; C08F22/10 ; C08F22/24
Abstract:
A positive resist composition including a base component (A) which exhibits increased solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the base component (A) including a polymeric compound (A1) containing a structural unit (a0) represented by general formula (a0-1) (R2 represents a divalent linking group, and R3 represents a cyclic group containing —SO2— within the ring skeleton thereof) and a structural unit (a1) derived from an acrylate ester containing an acid dissociable, dissolution inhibiting group.
Public/Granted literature
- US20100062369A1 Positive resist composition, method of forming resist pattern, and polymeric compound Public/Granted day:2010-03-11
Information query
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