Invention Grant
- Patent Title: Patterning process
- Patent Title (中): 图案化过程
-
Application No.: US12686836Application Date: 2010-01-13
-
Publication No.: US08192921B2Publication Date: 2012-06-05
- Inventor: Jun Hatakeyama , Takao Yoshihara , Kazuhiro Katayama
- Applicant: Jun Hatakeyama , Takao Yoshihara , Kazuhiro Katayama
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2009-006574 20090115
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/16 ; G03F7/20 ; G03F7/40

Abstract:
A pattern is formed by coating a chemically amplified positive resist composition comprising a resin comprising acid labile group-containing recurring units and a photoacid generator onto a substrate, drying to form a resist film, exposing the resist film to high-energy radiation through a phase shift mask having a lattice-like array of shifters, PEB, developing to form a positive pattern, illuminating or heating the positive pattern to eliminate acid labile groups for increasing alkaline solubility and to induce crosslinking for imparting solvent resistance, coating a reversal film, and dissolving away the positive pattern in an alkaline wet etchant to form a pattern by way of positive/negative reversal.
Public/Granted literature
- US20100178618A1 PATTERNING PROCESS Public/Granted day:2010-07-15
Information query