Invention Grant
- Patent Title: Method of forming semiconductor thin film and semiconductor thin film inspection apparatus
- Patent Title (中): 形成半导体薄膜的方法和半导体薄膜检测装置
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Application No.: US12468969Application Date: 2009-05-20
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Publication No.: US08193008B2Publication Date: 2012-06-05
- Inventor: Nobuhiko Umezu , Koichi Tsukihara , Hirohisa Amago , Go Matsunobu , Katsuya Shirai
- Applicant: Nobuhiko Umezu , Koichi Tsukihara , Hirohisa Amago , Go Matsunobu , Katsuya Shirai
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JP2008-135806 20080523; JP2009-020686 20090130
- Main IPC: H01L21/66
- IPC: H01L21/66

Abstract:
A method of forming a semiconductor thin film includes the steps of: forming an amorphous semiconductor thin film on a substrate; forming a crystalline semiconductor thin film partially in each element region by applying laser light to the amorphous semiconductor thin film to selectively perform a heating process on the amorphous semiconductor thin film, thereby crystallizing the amorphous semiconductor thin film in a region irradiated with the laser light; and inspecting the crystallinity degree of the crystalline semiconductor thin film. The step of inspecting includes the steps of determining a contrast between the luminance of a crystallized region and the luminance of a non-crystallized region by applying light to the crystalline semiconductor thin film and the amorphous semiconductor thin film, and performing screening of the crystalline semiconductor thin film on the basis of the determined contrast.
Public/Granted literature
- US20090291511A1 METHOD OF FORMING SEMICONDUCTOR THIN FILM AND SEMICONDUCTOR THIN FILM INSPECTION APPARATUS Public/Granted day:2009-11-26
Information query
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