Invention Grant
- Patent Title: Integrated circuit packaging system with pad connection and method of manufacture thereof
- Patent Title (中): 具有垫连接的集成电路封装系统及其制造方法
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Application No.: US12961490Application Date: 2010-12-06
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Publication No.: US08193037B1Publication Date: 2012-06-05
- Inventor: Henry Descalzo Bathan , Zigmund Ramirez Camacho , Dioscoro A. Merilo , Emmanuel Espiritu
- Applicant: Henry Descalzo Bathan , Zigmund Ramirez Camacho , Dioscoro A. Merilo , Emmanuel Espiritu
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent Mikio Ishimaru; Stanley Chang
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L21/48 ; H01L21/44
Abstract:
A method of manufacture of an integrated circuit packaging system includes: forming a lead having a horizontal ridge at a lead top side; forming a connection layer having an inner pad and an outer pad directly on the lead top side, the inner pad having an inner pad bottom surface; mounting an integrated circuit over the inner pad; applying a molding compound, having a molding bottom surface, over the integrated circuit, the inner pad, and the outer pad; and applying a dielectric directly on the molding bottom surface and the inner pad bottom surface.
Public/Granted literature
- US20120139121A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PAD CONNECTION AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2012-06-07
Information query
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