Invention Grant
- Patent Title: Manufacturing of a device including a semiconductor chip
- Patent Title (中): 包括半导体芯片的器件的制造
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Application No.: US12701779Application Date: 2010-02-08
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Publication No.: US08193040B2Publication Date: 2012-06-05
- Inventor: Georg Meyer-Berg
- Applicant: Georg Meyer-Berg
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Metal particles are applied to a metal foil. A semiconductor chip is placed over the metal foil with contact elements of the semiconductor chip facing the metal particles. The metal particles are heated and the metal foil is structured after heating the metal particles.
Public/Granted literature
- US20110193217A1 Manufacturing of a Device Including a Semiconductor Chip Public/Granted day:2011-08-11
Information query
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