Invention Grant
US08193047B2 Semiconductor device having sufficient process margin and method of forming same
有权
具有足够的加工余量的半导体器件及其形成方法
- Patent Title: Semiconductor device having sufficient process margin and method of forming same
- Patent Title (中): 具有足够的加工余量的半导体器件及其形成方法
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Application No.: US12654798Application Date: 2010-01-04
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Publication No.: US08193047B2Publication Date: 2012-06-05
- Inventor: Man-Hyoung Ryoo , Gi-Sung Yeo , Si-Hyeung Lee , Gyu-Chul Kim , Sung-Gon Jung , Chang-Min Park , Hoo-Sung Cho
- Applicant: Man-Hyoung Ryoo , Gi-Sung Yeo , Si-Hyeung Lee , Gyu-Chul Kim , Sung-Gon Jung , Chang-Min Park , Hoo-Sung Cho
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce
- Priority: KR2003-48223 20030715
- Main IPC: H01L21/8239
- IPC: H01L21/8239

Abstract:
According to some embodiments of the invention, a substrate doped with a P type impurity is provided. An N type impurity is doped into the substrate to divide the substrate into a P type impurity region and an N type impurity region. Active patterns having a first pitch are formed in the P type and N type impurity regions. Gate patterns having a second pitch are formed on the active patterns in a direction substantially perpendicular to the active patterns. Other embodiments are described and claimed.
Public/Granted literature
- US20100190303A1 Semiconductor device having sufficient process margin and method of forming same Public/Granted day:2010-07-29
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