Invention Grant
- Patent Title: Method of manufacturing semiconductor device
- Patent Title (中): 制造半导体器件的方法
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Application No.: US12638754Application Date: 2009-12-15
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Publication No.: US08193058B2Publication Date: 2012-06-05
- Inventor: Yugo Ide , Minori Kajimoto
- Applicant: Yugo Ide , Minori Kajimoto
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-167601 20070626
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A semiconductor device including a semiconductor substrate; a plurality of memory cell transistors aligned in a predetermined direction on the semiconductor substrate, each memory cell transistor provided with a first gate electrode including a floating gate electrode comprising a polycrystalline silicon layer of a first thickness, a control gate electrode provided above the floating gate electrode, and an inter-gate insulating film between the floating and the control gate electrode; a pair of select gate transistors on the semiconductor substrate with a pair of second gate electrodes neighboring in alignment with the first gate electrode, each second gate electrode including a lower-layer gate electrode comprising the polycrystalline silicon layer of the first thickness, an upper-layer gate electrode provided above the lower-layer gate electrode; a polyplug of the first thickness situated between the second gate electrodes of the pair of select gate transistors; and a metal plug provided on the polyplug.
Public/Granted literature
- US20100093143A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2010-04-15
Information query
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