Invention Grant
US08193070B2 Method for bonding layers, corresponding device and organic light-emitting diode
有权
接合层的方法，相应的器件和有机发光二极管
- Patent Title: Method for bonding layers, corresponding device and organic light-emitting diode
- Patent Title (中): 接合层的方法，相应的器件和有机发光二极管
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Application No.: US11992992Application Date: 2006-09-22
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Publication No.: US08193070B2Publication Date: 2012-06-05
- Inventor: Vincent Grolier , Andreas Plössl , Marianne Renner
- Applicant: Vincent Grolier , Andreas Plössl , Marianne Renner
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Cozen O'Connor
- Priority: DE102005046942 20050930
- International Application: PCT/DE2006/001688 WO 20060922
- International Announcement: WO2007/036208 WO 20070405
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L29/06
Abstract:
A method for bonding several layers, which comprise at least one thermally bondable material, by means of a joint layer produced with the aid of thermocompression at least one of the layers comprising a semiconductor material, as well as to a correspondingly manufactured device. Also disclosed is a method for manufacturing an organic light-emitting diode and an organic light-emitting diode that is encapsulated between two cover layers with the aid of thermocompression.
Public/Granted literature
- US20090218591A1 Method for Connecting Layers, Corresponding Component and Organic Light-Emitting Diode Public/Granted day:2009-09-03
Information query
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