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US08193073B2 Method for separating parts from a substrate 失效
从基板上分离零件的方法

  • Patent Title: Method for separating parts from a substrate
  • Patent Title (中): 从基板上分离零件的方法
  • Application No.: US11534863
    Application Date: 2006-09-25
  • Publication No.: US08193073B2
    Publication Date: 2012-06-05
  • Inventor: Jörn Besinger
  • Applicant: Jörn Besinger
  • Applicant Address: DE Mainz
  • Assignee: Schott AG
  • Current Assignee: Schott AG
  • Current Assignee Address: DE Mainz
  • Agency: DeMont & Breyer, LLC
  • Priority: DE102005046031 20050926
  • Main IPC: H01L21/00
  • IPC: H01L21/00
Method for separating parts from a substrate
Abstract:
An improved method for producing a plurality of parts (30) from a plate-type substrate (20) is disclosed, comprising the steps of: (a) laterally separating the parts (30) from a plate-type substrate (20) fixed on a first vacuum plate (3); (b) sucking the parts (30) on a first vacuum plate (3); and (c) detaching the separated parts (30) from the first vacuum plate (3).
Abstract(Chinese):

公开了一种用于从板式基板（20）制造多个部件（30）的改进方法，包括以下步骤：（a）将部件（30）与固定在板形基板（20）上的板型基板（20） 第一真空板（3）; （b）将第一真空板（3）上的部件（30）吸入; 和（c）将分离的部件（30）从第一真空板（3）分离。

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