Invention Grant
- Patent Title: Sealant composition
- Patent Title (中): 密封胶组成
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Application No.: US12546862Application Date: 2009-08-25
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Publication No.: US08193258B2Publication Date: 2012-06-05
- Inventor: Jauder Jeng , Man-Lin Chen , Pei-Ching Liu , Tien-Shou Shieh
- Applicant: Jauder Jeng , Man-Lin Chen , Pei-Ching Liu , Tien-Shou Shieh
- Applicant Address: TW
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW
- Agency: Lowe Hauptman Ham & Berner, LLP
- Priority: TW98114610A 20090501
- Main IPC: C08F2/50
- IPC: C08F2/50 ; C08L63/10

Abstract:
A sealant composition is provided. The sealant composition includes (a) an oligomer including an unsaturated mono-carboxylic acid modified bisphenol A epoxy resin and an unsaturated mono-carboxylic acid modified bisphenol F epoxy resin, wherein an equivalence ratio of the bisphenol A epoxy resin to the bisphenol F epoxy resin is 0.05:0.95 to 0.3:0.7, the bisphenol A epoxy resin has a melting point higher than 40° C. and the bisphenol F epoxy resin has a melting point lower than 40° C.; (b) an epoxy resin having at least two or more than two epoxy groups; and (c) a photoinitiator.
Public/Granted literature
- US20100280143A1 SEALANT COMPOSITION Public/Granted day:2010-11-04
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