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US08193269B2 Silicone resin composition for optical semiconductor devices and an optical semiconductor device 有权
用于光学半导体器件的硅树脂组合物和光学半导体器件

Silicone resin composition for optical semiconductor devices and an optical semiconductor device
Abstract:
Silicone resin composition for optical semiconductor devices, providing cured product wherein warpage in the devices is reduced and whiteness, heat-resistance, and light resistance are improved. The composition comprises: (A) an organopolysiloxane of the formula (CH3)aSi(OR1)b(OH)cO(4-a-b-c)/2  (1) wherein R1 is monovalent hydrocarbon and a, b, and c are numbers such that: 0.8
Abstract(Chinese):

用于光学半导体器件的硅树脂组合物提供固化产物，其中改善了器件中的翘曲和白度，耐热性和耐光性。 组合物包含：（A）式（CH3）aSi（OR1）b（OH）cO（4-abc）/ 2（1）的有机聚硅氧烷，其中R 1为一价烃，a，b和c为 ：0.8 <= a <= 1.5,0 <= b <= 0.3，0.001 <= c <= 0.5和0.801 <= a + b + c <2; （B）白色颜料; （C）除白色颜料以外的无机填料; （D）缩合催化剂; （E）衍生自异氰脲酸的环氧树脂; （F）包含单元R2SiO和单元RSiO1.5的有机聚硅氧烷，其中R是羟基，甲基，乙基，丙基，环己基，苯基，乙烯基或烯丙基; 和（G）下式的线性二有机聚硅氧烷，其中R 5和R 6是烷基，环己基，乙烯基，苯基或烯丙基，n是800至1200的整数。

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