Invention Grant
- Patent Title: Thermoelectric modules and related methods
- Patent Title (中): 热电模块及相关方法
-
Application No.: US12490204Application Date: 2009-06-23
-
Publication No.: US08193439B2Publication Date: 2012-06-05
- Inventor: Robert Michael Smythe , Jeffrey Gerard Hershberger
- Applicant: Robert Michael Smythe , Jeffrey Gerard Hershberger
- Applicant Address: US MO Earth City
- Assignee: Laird Technologies, Inc.
- Current Assignee: Laird Technologies, Inc.
- Current Assignee Address: US MO Earth City
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: H01L37/00
- IPC: H01L37/00 ; H01L35/34

Abstract:
An example method for making thermoelectric modules generally includes coupling a first wafer and a second wafer together, processing the first and second wafers to produce a first thermoelectric element and a second thermoelectric element where the first thermoelectric element and the second thermoelectric element are coupled together, coupling the first thermoelectric element to a first conductor, coupling the second thermoelectric element to a second conductor, separating the first thermoelectric element and the second thermoelectric element, coupling the first thermoelectric element to a third conductor whereby the first thermoelectric element, the first conductor, and the third conductor form at least part of a thermoelectric module, and coupling the second thermoelectric element to a fourth conductor whereby the second thermoelectric element, the second conductor, and the fourth conductor form at least part of another thermoelectric module.
Public/Granted literature
- US20100319744A1 THERMOELECTRIC MODULES AND RELATED METHODS Public/Granted day:2010-12-23
Information query
IPC分类: