The disclosed subject matter comprises a wire bridge that can dissipate heat from power wires of an electrically powered system to facilitate improving the lifetime of wires, reducing interference between wires, and reduce negative impaction of the electrically powered system. The wire bridge can be formed of a thermally conductive material to facilitate dissipating heat from associated wires, and can include a base component and a bridge component that is raised up from the base component wherein a subset of wires can be placed across and in contact with the bridge component. Optionally another subset of wires can be placed in an open gap created between the base component and bridge component; channels can be formed in the wire bridge wherein wires can be inserted; multiple bridge levels can be formed; or fasteners can be employed to fasten wires to the wire bridge.