Invention Grant
- Patent Title: Electronic apparatus and printed wiring board
- Patent Title (中): 电子设备和印刷电路板
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Application No.: US12470400Application Date: 2009-05-21
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Publication No.: US08193453B2Publication Date: 2012-06-05
- Inventor: Kenji Hasegawa , Tsuyoshi Kozai
- Applicant: Kenji Hasegawa , Tsuyoshi Kozai
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: JP2008-232392 20080910
- Main IPC: H05K1/02
- IPC: H05K1/02

Abstract:
According to an aspect of the present invention, there is provided a printed wiring board including: a substrate including a pair of edges and a fixing hole adjacent to the pair of edges and configured to receive a bolt; a land provided in a vicinity of the fixing hole and extending in a direction from the fixing hole toward a center of the substrate and along the pair of edges; and an insulating height adjuster provided between the fixing hole and the pair of edges and configured to have substantially the same height as the land.
Public/Granted literature
- US20100059264A1 ELECTRONIC APPARATUS AND PRINTED WIRING BOARD Public/Granted day:2010-03-11
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