Invention Grant
- Patent Title: Electrical inspection substrate unit and manufacturing method therefore
- Patent Title (中): 电检基板单元及其制造方法
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Application No.: US12493732Application Date: 2009-06-29
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Publication No.: US08193456B2Publication Date: 2012-06-05
- Inventor: Hiroyuki Takahashi , Chie Honda , Tatsuya Kato , Tomohide Yamada , Shigeru Taga
- Applicant: Hiroyuki Takahashi , Chie Honda , Tatsuya Kato , Tomohide Yamada , Shigeru Taga
- Applicant Address: JP Nagoya
- Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Stites & Harbison PLLC
- Agent Jeffrey A. Haeberlin
- Priority: JP2008-170737 20080630; JP2009-102147 20090420
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K3/02

Abstract:
An electrical testing substrate unit includes a multi-layer ceramic substrate formed of mullite and a borosilicate glass as predominant ceramic components. In the multi-layer ceramic substrate, the borosilicate glass contains an alkali metal oxide in an amount of 0.5 to 1.5 mass %. The multi-layer ceramic substrate has a mean coefficient of linear thermal expansion having a value of 3.0 to 4.0 ppm/° C. between −50° C. and 150° C. A thermal expansion coefficient, α1, of the multi-layer ceramic substrate as determined at a particular temperature and a thermal expansion coefficient, α2, of a to-be-tested silicon wafer as determined at the same temperature silicon satisfy a relation: 0 ppm/° C.
Public/Granted literature
- US20090321114A1 ELECTRICAL INSPECTION SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFORE Public/Granted day:2009-12-31
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