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US08193552B2 Semiconductor light emitting device of junction-down type and semiconductor light emitting element of junction-down type 有权
结合型半导体发光元件和结合型半导体发光元件

  • Patent Title: Semiconductor light emitting device of junction-down type and semiconductor light emitting element of junction-down type
  • Patent Title (中): 结合型半导体发光元件和结合型半导体发光元件
  • Application No.: US12320841
    Application Date: 2009-02-05
  • Publication No.: US08193552B2
    Publication Date: 2012-06-05
  • Inventor: Yuji Ishida
  • Applicant: Yuji Ishida
  • Applicant Address: JP Kyoto-fu
  • Assignee: Rohm Co., Ltd.
  • Current Assignee: Rohm Co., Ltd.
  • Current Assignee Address: JP Kyoto-fu
  • Agency: Rabin & Berdo, P.C.
  • Priority: JPP2008-028126 20080207; JPP2008-225988 20080903
  • Main IPC: H01L33/00
  • IPC: H01L33/00
Semiconductor light emitting device of junction-down type and semiconductor light emitting element of junction-down type
Abstract:
In a semiconductor light emitting device of junction-down type, a semiconductor light emitting element having a stripe part is provided with a bonding part for die bonding in a part of a surface thereof where the stripe part is formed, the bonding part being at a position away from the stripe part, and being junction-down bonded onto an electrode pattern on a holding substrate.
Abstract(Chinese):

在结低型半导体发光器件中，具有条纹部分的半导体发光元件在其形成条纹部分的表面的一部分中设置有用于芯片接合的接合部分，所述接合部分处于 位置远离条纹部分，并且被下降结合到保持基板上的电极图案上。

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