Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12908930Application Date: 2010-10-21
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Publication No.: US08193561B2Publication Date: 2012-06-05
- Inventor: Ken Sato
- Applicant: Ken Sato
- Applicant Address: JP Niiza-Shi
- Assignee: Sanken Electric Co., Ltd.
- Current Assignee: Sanken Electric Co., Ltd.
- Current Assignee Address: JP Niiza-Shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2009-243369 20091022
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor device reduces the on-resistance and, at the same time, raises the breakdown voltage. The drain electrode 20 of the semiconductor device runs through cap layer 13 and electron supply layer 12 and gets to a position lower than two-dimensional electron gas layer 14 in channel layer 11. Thus, the drain electrode 20 directly contacts the channel layer 11, the electron supply layer 12 and the cap layer 13. Angles (acute angles) θ, ø and ψ are formed by the drain electrode 20 and the channel layer 11, the electron supply layer 12 and the cap layer 13 as viewed in the direction in which a hetero interface is formed (the transverse direction in FIG. 1) and relationships of ø
Public/Granted literature
- US20110095337A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-04-28
Information query
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