A semiconductor die package. The semiconductor die package includes a leadframe structure comprising a first lead structure comprising a die attach pad, a second lead structure, and a third lead structure. It also includes a semiconductor die comprising a first surface and a second surface. The semiconductor die is on the die attach pad of the leadframe structure. The first surface is proximate the die attach pad. The semiconductor die package further includes a clip structure comprising a first interconnect structure and a second interconnect structure, the first interconnect structure comprising a planar portion and a protruding portion, the protruding portion including an exterior surface and side surfaces defining the exterior surface. The protruding portion extends from the planar portion of the first interconnect structure. The second surface of the semiconductor die is proximate to the clip structure, and a molding material covers at least the semiconductor die and at least a portion of the side surfaces of the protruding portion.