Invention Grant
US08193624B1 Semiconductor device having improved contact interface reliability and method therefor
有权
具有改善的接触界面可靠性的半导体器件及其方法
- Patent Title: Semiconductor device having improved contact interface reliability and method therefor
- Patent Title (中): 具有改善的接触界面可靠性的半导体器件及其方法
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Application No.: US12036498Application Date: 2008-02-25
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Publication No.: US08193624B1Publication Date: 2012-06-05
- Inventor: Eun Sook Sohn
- Applicant: Eun Sook Sohn
- Applicant Address: US AZ Chandler
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Chandler
- Agency: Weiss & Moy, P.C.
- Agent Jeffrey D. Moy
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A semiconductor package assembly has a first semiconductor package. A plurality of first solder balls is attached to the first semiconductor package. A circuit board is provided having a plurality of mounting pads that is electrically connected to the plurality of first solder balls. A first underfill is disposed on each of the plurality of first solder balls. The first underfill is disposed on interfaces between each of the plurality of first solder balls and the first semiconductor package and each of the plurality of first solder balls and the circuit board. The first underfill is removed from an area between adjacent first solder balls.
Information query
IPC分类:
