Invention Grant
US08193627B2 IC chip mounting package provided with IC chip located in device hole formed within a package base member
有权
IC芯片安装封装设置有位于封装基体内形成的器件孔中的IC芯片
- Patent Title: IC chip mounting package provided with IC chip located in device hole formed within a package base member
- Patent Title (中): IC芯片安装封装设置有位于封装基体内形成的器件孔中的IC芯片
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Application No.: US12448106Application Date: 2007-11-30
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Publication No.: US08193627B2Publication Date: 2012-06-05
- Inventor: Satoru Kudose , Tomokatsu Nakagawa , Tatsuya Katoh
- Applicant: Satoru Kudose , Tomokatsu Nakagawa , Tatsuya Katoh
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2006-333702 20061211
- International Application: PCT/JP2007/073197 WO 20071130
- International Announcement: WO2008/072491 WO 20080619
- Main IPC: H01L23/18
- IPC: H01L23/18 ; H01L21/56 ; H01L23/48
Abstract:
In one embodiment of the present invention, an IC chip mounting package is arranged such that an IC chip and a film base member are connected via an interposer, and a section in which the IC chip, the film base member, and the interposer are connected is sealed with sealing resin. The sealing resin is provided by potting sealing resin around the interposer via a potting nozzle, or is provided by potting the sealing resin around the IC chip, that is, via a device hole. Moreover, the sealing resin has a coefficient of linear expansion of not more than 80 ppm/° C., a viscosity of not less than 0.05 Pa·s but not more than 0.25 Pa·s, and also includes filler having a particle size of not more than 1 μm.
Public/Granted literature
- US20090273071A1 IC CHIP MOUNTING PACKAGE AND PROCESS FOR MANUFACTURING THE SAME Public/Granted day:2009-11-05
Information query
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