Invention Grant
US08193628B2 Printed wiring board, a method of manufacturing printed wiring board, a sensor module, and a sensing device
有权
印刷电路板，制造印刷电路板的方法，传感器模块和感测装置
- Patent Title: Printed wiring board, a method of manufacturing printed wiring board, a sensor module, and a sensing device
- Patent Title (中): 印刷电路板，制造印刷电路板的方法，传感器模块和感测装置
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Application No.: US12557020Application Date: 2009-09-10
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Publication No.: US08193628B2Publication Date: 2012-06-05
- Inventor: Toshihiko Makino , Atsushi Koyanagi
- Applicant: Toshihiko Makino , Atsushi Koyanagi
- Applicant Address: JP Tokyo
- Assignee: Ricoh Company, Ltd.
- Current Assignee: Ricoh Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-260814 20081007; JP2008-317853 20081215
- Main IPC: H01L23/12
- IPC: H01L23/12
Abstract:
A printed wiring board on which a package to be arranged, including: a first layer that is relatively rigid; and a second layer that is relatively flexible and on which the package is to be soldered, wherein an area other than a package arrangement area of the second layer is joined to the first layer by an adhesion layer.
Public/Granted literature
Information query
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