Invention Grant
- Patent Title: Backlight module with a heat conductive block
- Patent Title (中): 背光模块带导热块
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Application No.: US12881145Application Date: 2010-09-13
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Publication No.: US08194208B2Publication Date: 2012-06-05
- Inventor: Meng-chai Wu , Chi-chung Lo , Chin-kun Hsieh , Cheng-chih Lai , Chi-chen Cheng
- Applicant: Meng-chai Wu , Chi-chung Lo , Chin-kun Hsieh , Cheng-chih Lai , Chi-chen Cheng
- Applicant Address: TW Hsin-Chu
- Assignee: AU Optronics Corp.
- Current Assignee: AU Optronics Corp.
- Current Assignee Address: TW Hsin-Chu
- Priority: TW94146287A 20051223
- Main IPC: G02F1/1333
- IPC: G02F1/1333 ; G02F1/1335 ; F21V7/04
Abstract:
A backlight module includes a bezel having at least one edge, a circuit board, one or more light emitting diodes connected to the circuit board for emitting light. Each light emitting diode has a light axis which is neither parallel nor vertical to the edge of the bezel. The backlight module utilizes a heat conductive block disposed between the bezel and the light emitting diode for transferring heat generated by the light emitting diode to the bezel.
Public/Granted literature
- US20110007521A1 BACKLIGHT MODULE WITH A HEAT CONDUCTIVE BLOCK Public/Granted day:2011-01-13
Information query
IPC分类:
