Invention Grant
- Patent Title: Package for micromirror device
- Patent Title (中): 微镜器件封装
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Application No.: US12231922Application Date: 2008-09-05
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Publication No.: US08194305B2Publication Date: 2012-06-05
- Inventor: Yoshihiro Maeda , Hirokazu Nishino , Akira Shirai , Hirotoshi Ichikawa , Fusao Ishii
- Applicant: Yoshihiro Maeda , Hirokazu Nishino , Akira Shirai , Hirotoshi Ichikawa , Fusao Ishii
- Applicant Address: JP JP
- Assignee: Silicon Quest Kabushiki-Kaisha,Olympus Corporation
- Current Assignee: Silicon Quest Kabushiki-Kaisha,Olympus Corporation
- Current Assignee Address: JP JP
- Agent Bo-In Lin
- Main IPC: G02B26/00
- IPC: G02B26/00 ; G02B26/08 ; G02F1/29
Abstract:
The present invention discloses a mirror device that includes a mirror element which further comprising an elastic hinge and a mirror and which modulates incident light emitted from a light source, a device substrate on which a drive circuit for driving the mirror element is placed, a package substrate which is made of transparent glass or a silicon material and on which the device substrate is placed, a metallic thermal transfer path connected to the device substrate, and a cover glass connected to the package substrate so that the device substrate is covered.
Public/Granted literature
- US20090008669A1 Package for micromirror device Public/Granted day:2009-01-08
Information query
