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US08194335B2 Optical lens on wafer level and related method for forming the optical lens one wafer level 有权
晶圆上的光学透镜及用于将光学透镜形成一晶片级的相关方法

  • Patent Title: Optical lens on wafer level and related method for forming the optical lens one wafer level
  • Patent Title (中): 晶圆上的光学透镜及用于将光学透镜形成一晶片级的相关方法
  • Application No.: US12758807
    Application Date: 2010-04-13
  • Publication No.: US08194335B2
    Publication Date: 2012-06-05
  • Inventor: Chuan-Ching Hsueh
  • Applicant: Chuan-Ching Hsueh
  • Applicant Address: TW Xinshi Dist., Tainan
  • Assignee: Himax Technologies Limited
  • Current Assignee: Himax Technologies Limited
  • Current Assignee Address: TW Xinshi Dist., Tainan
  • Agent Winston Hsu; Scott Margo
  • Main IPC: G02B7/02
  • IPC: G02B7/02
Optical lens on wafer level and related method for forming the optical lens one wafer level
Abstract:
An optical lens on wafer level consists of a first optical component, a first spacer, a second optical component, at least a first via plug, and an adhesion material. The first spacer includes at least a first via plug passing through the first spacer, wherein the first optical component and the second optical component are separated by the first spacer. The adhesion material is coated in between the first optical component and the first spacer and coated in between the first spacer and the second optical component, and is filled in at least a portion of the first via plug.
Abstract(Chinese):

晶片级的光学透镜由第一光学部件，第一间隔物，第二光学部件，至少第一通孔塞和粘合材料构成。 第一间隔件至少包括穿过第一间隔件的第一通孔塞，其中第一光学部件和第二光学部件被第一间隔件隔开。 粘合材料被涂覆在第一光学部件和第一间隔件之间并被涂覆在第一间隔件和第二光学部件之间，并且被填充在第一通孔塞的至少一部分中。

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