Invention Grant
- Patent Title: Multilayer chip capacitor including two terminals
- Patent Title (中): 多层片式电容器包括两个端子
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Application No.: US12245865Application Date: 2008-10-06
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Publication No.: US08194389B2Publication Date: 2012-06-05
- Inventor: Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
- Applicant: Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2008-0015732 20080221
- Main IPC: H01G4/005
- IPC: H01G4/005 ; H01G4/06 ; H01G4/228

Abstract:
A multilayer chip capacitor includes a capacitor body including first and second longer side surfaces facing each other and first and second shorter side surfaces facing each other, first and second external electrodes respectively disposed at the first and second longer side surfaces, one or more first internal electrode pairs each including first and second internal electrodes, and one or more second internal electrode pairs each including third and fourth internal electrodes. The first to fourth internal electrodes each have one lead and are sequentially disposed in a stacked direction. The first to fourth internal electrodes have first to fourth leads respectively extending to first to fourth corners or portions adjacent thereto, and alternately connected with the first and second external electrodes. The first internal electrode pair and the second internal electrode pair cause a current to diagonally flow in opposite directions with respect to a long side direction.
Public/Granted literature
- US20090213525A1 MULTILAYER CHIP CAPACITOR Public/Granted day:2009-08-27
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