Invention Grant
- Patent Title: Heat radiation material, electronic device and method of manufacturing electronic device
- Patent Title (中): 散热材料，电子器件及制造电子器件的方法
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Application No.: US12614063Application Date: 2009-11-06
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Publication No.: US08194407B2Publication Date: 2012-06-05
- Inventor: Yoshitaka Yamaguchi , Taisuke Iwai , Shinichi Hirose , Daiyu Kondo , Ikuo Soga , Yohei Yagishita , Yukie Sakita
- Applicant: Yoshitaka Yamaguchi , Taisuke Iwai , Shinichi Hirose , Daiyu Kondo , Ikuo Soga , Yohei Yagishita , Yukie Sakita
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2008-292320 20081114
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.
Public/Granted literature
- US20100124025A1 HEAT RADIATION MATERIAL, ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE Public/Granted day:2010-05-20
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