Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US12647395Application Date: 2009-12-25
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Publication No.: US08194412B2Publication Date: 2012-06-05
- Inventor: Hua-Li Zhou , Chia-Nan Pai , Shou-Kuo Hsu
- Applicant: Hua-Li Zhou , Chia-Nan Pai , Shou-Kuo Hsu
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200910308935 20091028
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/16 ; H05K7/00

Abstract:
A printed circuit board includes a signal plane and a reference plane. The signal plane includes a pad, a passive element mounted on the pad, and a signal transmission line electrically connected to the passive element via the pad. The reference plane provides a return path for a signal transmitted through the passive element and the signal transmission line. A void is defined in the reference plane corresponding to the passive element, to increase a length of the return path. A length of a first axis, perpendicular to the signal transmission line, of the void satisfies a following equation: W 1 ≈ 8 Wpad + 10 T 0.8 Wtrace + T , wherein Wpad is a width of the pad, Wtrace is a width of the transmission line, T is the height of the pad.
Public/Granted literature
- US20110094782A1 PRINTED CIRCUIT BOARD Public/Granted day:2011-04-28
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