Invention Grant
- Patent Title: Multilayer printed circuit board having electromagnetic wave reduction member
- Patent Title (中): 具有电磁波减压构件的多层印刷电路板
-
Application No.: US11970051Application Date: 2008-01-07
-
Publication No.: US08194416B2Publication Date: 2012-06-05
- Inventor: Hark Byeong Park , Byong Su Seol , Hyung Geun Kim , Hyun Ho Park , Jong Sung Lee , Hyung Seok Lee , Young Jun Moon
- Applicant: Hark Byeong Park , Byong Su Seol , Hyung Geun Kim , Hyun Ho Park , Jong Sung Lee , Hyung Seok Lee , Young Jun Moon
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Stanzione & Kim, LLP
- Priority: KR10-2007-0016854 20070216
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
Disclosed is a multilayer printed circuit board. The multilayer printed circuit board includes a power source surface to provide power to each component disposed on the power source surface, a ground surface having a reference voltage, a strip line which passes through the power source surface and/or the ground surface so as to transmit signals between components, an antenna installed in proximity to a sectional region of the power source surface and the ground surface, and an electromagnetic wave reduction member which is provided between the power source surface and the ground surface to effectively reduce an electromagnetic wave generated from the strip line.
Public/Granted literature
- US20080198567A1 MULTILAYER PRINTED CIRCUIT BOARD Public/Granted day:2008-08-21
Information query